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| 대응기판 | L 50 mm x W 50 mm to L 510 mm x W 460 mm |
| High-speed head Max. speed Placement accuracy Component dimensions |
12 nozzles |
| 100,000 cph (0.036 s/chip (Type A-2)) | |
| ±40μm/chip (Cpk≥1) | |
| 0402 chip to L 12 mm x W 12 mm x T 6.5 mm | |
| High-flexibility head Max. speed Placement accuracy Component dimensions |
LS 8 nozzles |
| 75,000 cph (0.048 s/chip (Type A-0)) | |
| ±40μm/chip, ±35μm/QFP＞ㅁ24mm, ±50μm/QFP ㅁ24mm (Cpk≥1) | |
| 0402 chip to L 32 mm x W 32 mm x T 8.5 mm | |
| When the generalized Ver.5 is optionally selected 0402 chip to L 100mm x W 50 mm x T 15mm | |
| High-functional head Max. speed Placement accuracy Component dimensions |
3 nozzles |
| 20,000 cph (0.18 s/QFP (Type B-0)) | |
| ±35μm/QFP (Cpk≥1) | |
| 0603 chip to L 100 mm x W 90 mm x T 25 mm | |
| PCB 반송대기시간 | 0.9 s (Board length : up to 240 mm Under optimum conditions) |
| 전원 | 3-phase AC 200, 220, 380, 400, 420, 480 V, 4.9 kVA |
| 공압원 | 0.49MPa, 170 L/min (A.N.R.) |
| 설비크기 | W 2,350 mm x D 2,290 mm x H 1,430 mm |
| 무게 | 3,400 kg |
